Description
The XG-50 BGA Tin Solder Paste by MECHANIC is a high-quality soldering solution designed for precision electronics assembly and repair. With a eutectic alloy composition of Sn63/Pb37 and fine powder granularity, it ensures excellent wetting, smooth solder joints, and strong reliability. This solder paste is widely used for BGA reballing, SMT rework, and PCB assembly, making it an essential tool for hobbyists, technicians, and professional repair engineers.
Key Features
- High-quality MECHANIC brand solder paste for electronics repair
- Eutectic Sn63/Pb37 alloy for stable melting performance
- Fine particle size for smooth application and strong adhesion
- Low melting point at 183°C for efficient rework
- Ideal for BGA reballing, SMT soldering, and PCB assembly
- Packaged in a 42g container for convenient use and storage
Specification
- Brand: MECHANIC
- Model: XG-50 / XGSP50
- Alloy Composition: Sn63% / Pb37%
- Micron Size:
- XG-50 → 25–45µm
- XGSP50 → 20–38µm
- Weight: 42g
- Melting Point: 183°C
Application
- BGA Reballing: Reliable for reflowing and repairing IC chips
- SMT Assembly: Suitable for surface-mount soldering on PCBs
- Electronics Repair: Ideal for laptops, mobile phones, and other consumer electronics
- Prototyping & DIY Projects: Perfect for makers and hobbyists needing precise solder joints